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Diamond wire for sapphire and silicon cutting
Model Number: D0.10~D0.50
Brand Name: XINYA
Key Specifications/Special Features:
Electroplated diamond wire is a type of fixed abrasive diamond wire. It's used for cutting semiconductors material, such as silicon, sapphire. Based on the abrasi... |
2017-12-21 |
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Diamond grinding wheel for semiconductor
Model Number: D100~D500
Brand Name: XINYA
Key Specifications/Special Features:
Resin diamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors materia... |
2017-11-23 |
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Diamond polishing discs
Model Number: D100-200-62-#0113
Brand Name: XINYA
Key Specifications/Special Features:
Diamond polishing discare special used for polishingtungsten carbide,ceramic, glass and more.Semi-conductors material, such as silicone, sapphireSpecial diamo... |
2017-10-08 |
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Diamond saw blade, electroplated, for stone, glass, carbon products, glass fiber products
Model Number: D100~D600-#6659
Brand Name: XINYA
Key Specifications/Special Features:
The metal bond diamond saw blades are used for cuttingstone, concrete, glass, carbon products, glass fiber products and GRP products.The diamond saw bladeshav... |
2017-09-12 |
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Metal bond Diamond grinding wheel for sapphire, silicon,metal bond,grinding glass,grinding stone
Model Number: D100~D250-#5308
Brand Name: XINYA
Key Specifications/Special Features:
Resin diamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors m... |
2017-07-31 |
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